리버스엔지니어링
Package
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Package top view
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Package top view
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Package top view
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Package top view
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Package top view
Substrate
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bump level
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1st substrate level
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2nd substrate level
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3rd substrate level
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4th substrate level
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Package ball level
Bump Pad
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Bump pads image
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Bump pad dimensions
Die
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Die photograph @Top Metal Level
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Die marking