R&D Center
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| Simulation License | Simulaion Service | ||
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| Mechanical | ANSYS Enterprise | Package Warpage / Stress |
- Room temp. after molding process - High(Peak) temp. in reflow process |
| Package Reliability |
- Solder fatigue - Drop(impact) / Bend test |
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| Thermal | 6 Sigma ET Flotherm | Die Temperature | |
| Package Thermal Resistance | - Theta-Ja, Theta-Jb, Theta-Jc | ||
| Package Characteristics Parameter | - Psi-J, Psi-Jb | ||
| Electrical |
ANSYS Si Wave Q3D HFSS ANSYS Si option [Designer SI] |
Parastic Element extraction | - Characteristic Impedance |
| - RLCG Parameter | |||
| Signal Intergrity / PI |
- TDR, Eye-Diagram - S-Parameter |
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